June 1, 2007—Intel Corporation has announced that its processors, beginning with its fastest line of Intel Core 2 Duo, Core 2 Quad and Xeon processors (45-nanometer Hi-k), will be 100 percent lead-free from now on—part of the company’s “aggressive stance” toward environmental sustainability.
In 2008, the company will also transition its 65nm chipset products to lead-free technology. Intel had already reduced the lead in its microprocessor and chipset packages by 95 percent beginning in 2004.
Lead is used in a variety of micro-electronic “packages” and the “bumps” that attach an Intel chip to the packages, explains Intel. Packages wrap around the chip and ultimately connect it to the motherboard. Different types of packages are used for processors targeted at specific market segments, including mobile, desktop, and server. Package designs include pin grid array, ball grid array, and land grid array.
Intel’s 45nm processors also make use of the company’s Hi-k silicon technology for reduced transistor leakage, enabling more energy-efficient, high-performance processors, says the company. The 45nm Hi-k silicon technology also reportedly includes third-generation strained silicon for improved drive current and a lower interconnect capacitance, using low-k dielectrics for increased performance and lower power. Ultimately, Intel’s 45nm Hi-k family of processors will enable sleeker, smaller, and more energy-efficient desktop, notebook PC, mobile internet device and server designs, says the company.
For more information, visit Intel’s Environmental Health & Safety page or its ROHS/Lead (Pb) Free Solutions page.
